The Multilevel Stencils are designed to print more than one height in a single pass and to deposit the necessary paste for the different components of a single circuit.
This is achieved by making the recess on the squeegee side of the Stencil. It is also increasingly used to bridge areas of the PCB such as graphite, silver bridges or via true hole and to ensure that the Stencil has good contact with the PCB. In this case, the recess is made on the PCB side of the Stencil.
There are different manufacturing processes to achieve the different heights in the Stencils for SMD: