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An SMD stencil is based on the material used to cut the openings. This material has evolved over the years.

We can currently offer you the following materials:[/vc_column_text][/vc_column][/vc_row][vc_row][vc_column][vc_column_text css=”.vc_custom_1653886633568{background-color: #eba43e !important;}”]

PhD Stainless Steel (SUS304):
Hardness: 390-400 HV
Particle size: 7-11 μm
Thickness tolerance: ± 2%
Thicknesses: 50, 80, 100, 110, 120, 130, 140, 150, 180, 200, 250, 300, 350, 400, 450 , 500 microns

Tensile Stainless Steel (SUS301):
Hardness: 500-550 HV
Rework/Mini Stencils
Tool required for reworking, assembling, or repairing
fine-pitch, BGA, or mini BGA components.
Various models of stencils, according to requirements.
Mini spatula for depositing solder paste.
particle size: 2-5 μm
Thickness tolerance: ± 2%
Thicknesses: 80, 100, 120, 130, 150, 180, 200 microns

FG Stainless Steel (SUS301):
Hardness: 390-400 HV
Particle size: < 5 μm
Thickness tolerance: ± 2%
Thicknesses: 100, 120, 130, 150, 180, 200, 250, 300 microns

Nickel:
Hardness: ± 600 HV
Particle size: ± 15 μm
Thickness tolerance: ± 5%
Thicknesses: 100, 120, 125, 130, 150, 175, 200, 250 microns

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