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Electroforming

Home SMD Stencils and others Technologies Electroforming

This product is produced by applying nickel onto a substrate. The stencil and the pads are created as the material is applied. Recommended for Micro BGA’s, Ultra Fine Pitch and small 0201-type components.

Characteristics

Material

EF nickel.

Thicknesses

According to the client’s specifications.

Opening precision

+/- 2 microns.

Thickness precision

+/- 10 microns.

Advantages

Reduced cleaning cycles.

Recommended for large production volumes.

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